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Plasma Treatment System
Introduce

Model: PCS-8LA
Update time: 2026-01-02
Visit volume: 125
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▍Product Profile

 EWIN-TECH  PCS-8LA is a plasma treatment system specifically built for scientific research and micro-nanofabrication scenarios, suitable for various applications such as material surface cleaning, activation, and modification. The equipment adopts a 13.56MHz RF plasma source, combined with a stainless steel reaction chamber, mass flow control, and a PLC control system with automatic/manual switching to achieve efficient, low-damage dry cleaning of material surfaces. Compared to thermal damage issues caused by strong ion bombardment in conventional plasma cleaning methods, this equipment significantly reduces physical damage to sensitive materials and enhances treatment consistency and controllability through precise power control and process area optimization, making it an ideal choice for research users and small-batch verification processes.


▍ Technical Features

1. Intelligent control interface ·Full-color touchscreen operation, intuitive control of various parameters ·Advanced PLC system realizes closed-loop temperature control, ensuring stable and reliable programs.

2. Automatic lifting and non-contact baking ·Supports timed automatic lifting for substrate retrieval, improving experimental efficiency ·Arbitrarily adjustable proximity pin height to achieve non-contact baking.

3. High safety and structural optimization ·Built-in independent overheat protection circuit to prevent accidental over-temperature ·Equipment equipped with a dust-proof thermal insulation top cover to reduce heat loss and particle interference ·Mirror-finish stainless steel shell, aesthetic and durable, easy to clean.


Technical Specifications

ItemSpecification
ModelPCS-8LA (8")
Equipment AppearancePlastic spray finish
Dimensions720mm × 620mm × 600mm (Excluding mechanical pump)
Reaction ChamberMaterial: Stainless steel; Size: 250mm × 200mm × 250mm
Plasma Frequency13.56MHz
RF Power0-300W adjustable
Equipment Power≤1kW
Control MethodPLC control including touchscreen HMI; operation modes include automatic and manual modes
MFC (Mass Flow Controller) ControlStandard configuration: 2 channels
Gas FlowProcess gas (O2, Ar, etc.): (0~200) ml/min (Standard pressure, 0°C)
Working and Purge/Cooling Gas Interface PressureProcess gas (standard O2, Ar) interface pressure: 0.1MPa (Statement required for other gases); Purge/cooling gas (N2) interface pressure: 0.5MPa
Equipment Cycle TimeSingle cleaning time for dry run ≤5min
Equipment MES Compatible InterfaceThe equipment transmits process parameters to the MES platform via data network


▍Typical Applications

Plasma treatment systems are widely used for precision cleaning in industries such as semiconductors, thick-film circuits, PCB manufacturing, component packaging, COG pre-treatment, vacuum electronics, connectors, and relays, as well as surface activation of plastics, rubber, metals, and ceramics, and life science experiments.










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