Product Center
Location: Home
Product Center
Semiconductor Application Series > High-Precision Hot Plate / Bake Station > High-Precision Hotplate

Introduce
product
+8618421914845
article
▍Product Profile
EWIN-TECH HPT-L7 High-Precision Hotplate is oriented toward R&D and pilot production needs in fields such as semiconductors, micro-nanofabrication, and optoelectronics. It adopts an anodized aluminum heating plate with excellent corrosion resistance and thermal uniformity. Integrating functions such as multi-stage temperature control, touch operation, and non-contact thermal processing, it supports thermal treatment for various wafer specifications and is especially suitable for high-cleanliness, high-stability pre-bake and post-bake coating process scenarios.
1.High-precision thermal control system: Temperature range covers room temperature to 250°C, resolution 0.1°C, temperature uniformity ±2%, ensuring the stability of critical processes.
2. Non-contact baking function: Adjustable proximity pin height (0–30mm), meeting the non-contact thermal processing needs for sensitive substrates.
3. Multi-stage program control: Supports up to 12 segments of temperature control settings, adapting to complex thermal treatment workflows.
4. Intelligent operating system: 7-inch full-color touchscreen combined with PLC control, intuitive operation, and real-time parameter management.
5. Safety and maintenance convenience: Built-in over-temperature protection, supports timed lifting/lowering for substrate retrieval; mirror-finish stainless steel shell, dust-proof and aesthetic, easy to clean.
| Parameter | Specification |
| Model | HPT-L7 |
| Temperature Range | RT – 250°C |
| Temperature Resolution | 0.1°C |
| Temperature Uniformity | ±2% |
| Plate Material | Anodized Aluminum |
| Control System | PLC with 7-inch Color Touchscreen |
| Program Segments | Up to 12 Segments |
| Proximity Pin Height | 0 – 30 mm (Adjustable) |
| Housing Material | Mirror-finish Stainless Steel |
▍Typical Applications
High-precision hotplates are suitable for scientific research and pilot production environments with strict requirements for temperature control precision and thermal uniformity. They are widely applied in lithography pre-bake/post-bake, thermal treatment of micro-nano structures and thin-film devices, processes with special requirements for non-contact thermal treatment such as MEMS/OLED/flexible electronics, as well as temperature control experiments in material R&D and advanced packaging.
Prev: Plasma Treatment System
Return
Next: ATR-SEIRAS/ Attenuated Total Reflection Surface-Enhanced Infrared Absorption Spectroscopy 
Message