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High-Precision Hotplate
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Model: HPT-L7
Update time: 2026-01-02
Visit volume: 131
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▍Product Profile

EWIN-TECH HPT-L7 High-Precision Hotplate is oriented toward R&D and pilot production needs in fields such as semiconductors, micro-nanofabrication, and optoelectronics. It adopts an anodized aluminum heating plate with excellent corrosion resistance and thermal uniformity. Integrating functions such as multi-stage temperature control, touch operation, and non-contact thermal processing, it supports thermal treatment for various wafer specifications and is especially suitable for high-cleanliness, high-stability pre-bake and post-bake coating process scenarios.

▍Technical Features

1.High-precision thermal control system: Temperature range covers room temperature to 250°C, resolution 0.1°C, temperature uniformity ±2%, ensuring the stability of critical processes.

2. Non-contact baking function: Adjustable proximity pin height (0–30mm), meeting the non-contact thermal processing needs for sensitive substrates.

3. Multi-stage program control: Supports up to 12 segments of temperature control settings, adapting to complex thermal treatment workflows.

4. Intelligent operating system: 7-inch full-color touchscreen combined with PLC control, intuitive operation, and real-time parameter management.

5. Safety and maintenance convenience: Built-in over-temperature protection, supports timed lifting/lowering for substrate retrieval; mirror-finish stainless steel shell, dust-proof and aesthetic, easy to clean.


Technical Specifications

ParameterSpecification
ModelHPT-L7
Temperature RangeRT – 250°C
Temperature Resolution0.1°C
Temperature Uniformity±2%
Plate MaterialAnodized Aluminum
Control SystemPLC with 7-inch Color Touchscreen
Program SegmentsUp to 12 Segments
Proximity Pin Height0 – 30 mm (Adjustable)
Housing MaterialMirror-finish Stainless Steel

▍Typical Applications

 High-precision hotplates are suitable for scientific research and pilot production environments with strict requirements for temperature control precision and thermal uniformity. They are widely applied in lithography pre-bake/post-bake, thermal treatment of micro-nano structures and thin-film devices, processes with special requirements for non-contact thermal treatment such as MEMS/OLED/flexible electronics, as well as temperature control experiments in material R&D and advanced packaging.

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